| Impedance Control Capabilities | |||
| PP Dielectric constant | |||
| PP | Dielectric constant | ||
| 7628 | 4.6 | ||
| 2313 | 4.05 | ||
| 2116 | 4.25 | ||
| 2.The parameter to calcalate the solder mask | |||
| The covering layer on the substrate. | The covering layer on the line | Resistance welding dielectric constant. | |
| 0.8mil | 0.5mil | 3.8mil | |
| 4 layers board impedance control lamination structure | |||
| 1.Finished board thickness：0.8MM | |||
| 1） 7628 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 7628*1 | 0.2mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.265mm | 0.3mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 7628*1 | 0.2mm | |
| Bottom line 4 | 0.035mm | ||
| 2） 2313 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.465mm | 0.5mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 2313*1 | 0.1mm | |
| Bottom line 4 | 0.035mm | ||
| 2.Finished board thickness：1.0MM | |||
| 1） 7628 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 7628*1 | 0.2mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.465mm | 0.5mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 7628*1 | 0.2mm | |
| Bottom line 4 | 0.035mm | ||
| 2) 2313 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.665mm | 0.7mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 2313*1 | 0.1mm | |
| Bottom line 4 | 0.035mm | ||
| 3.Finished board thickness：1.2MM | |||
| 1) 7628 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 7628*1 | 0.2mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.665mm | 0.7mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 7628*1 | 0.2mm | |
| Bottom line 4 | 0.035mm | ||
| 2) 2313 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.865mm | 0.9mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 2313*1 | 0.1mm | |
| Bottom line 4 | 0.035mm | ||
| 4.Finished board thickness：1.6MM | |||
| 1) 7628 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 7628*1 | 0.2mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 1.065mm | 1.1mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 7628*1 | 0.2mm | |
| Bottom line 4 | 0.035mm | ||
| 3) 2313 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 1.265mm | 1.3mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 2313*1 | 0.1mm | |
| Bottom line 4 | 0.035mm | ||
| 5.Finished board thickness：2.0MM | |||
| 7628 Structure | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top line 1 | 0.035mm | ||
| Press pp (Prepreg) | 7628*1 | 0.2mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 1.465mm | 1.5mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp (Prepreg) | 7628*1 | 0.2mm | |
| Bottom line 4 | 0.035mm | ||
| Remark：2.0mm thickness board only provide 1 laminating structure. | |||
| 6 layers board impedance lamination structure | |||
| 1.Finished board thickness：1.2MM | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top circuit layer 1 | 0.035mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.365mm | 0.4mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp | 2116*1 | 0.127mm | |
| Intermediate circuit layer 4 | 0.0175mm | ||
| Core plate | core | 0.365mm | 0.4mm(including copper core plate) |
| Intermediate circuit layer 5 | 0.0175mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Bottom circuits layer 6 | 0.035mm | ||
| 2.Finished board thickness：1.6MM | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top circuit layer 1 | 0.035mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.565mm | 0.6mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp | 2116*1 | 0.127mm | |
| Intermediate circuit layer 4 | 0.0175mm | ||
| Core plate | core | 0.565mm | 0.6mm(including copper core plate) |
| Intermediate circuit layer 5 | 0.0175mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Bottom circuits layer 6 | 0.035mm | ||
| 3.Finished board thickness：2.0MM | |||
| Layers | Lamination | Thickness of dielectric layers | |
| Top circuit layer 1 | 0.035mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Intermediate circuit layer 2 | 0.0175mm | ||
| Core plate | Core | 0.665mm | 0.7mm(including copper core plate) |
| Intermediate circuit layer 3 | 0.0175mm | ||
| Pressing pp | 7628*1 | 0.2mm | |
| Intermediate circuit layer 4 | 0.0175mm | ||
| Core plate | core | 0.665mm | 0.7mm(including copper core plate) |
| Intermediate circuit layer 5 | 0.0175mm | ||
| Pressing pp | 2313*1 | 0.1mm | |
| Bottom circuits layer 6 | 0.035mm | ||
| Remark：Only one stackup reference for 6L board | |||
