We provide standard FR4 circuit board prototyping, small-batch production, as well as high-layer-count PCB prototyping and fabrication with special processes. All manufacturing strictly follows the industry IPC Class 2 standards, delivering fast, efficient, and high-quality solutions for various PCB design projects.
Below are the process parameters for standard and advanced manufacturing options, for reference only. If you need more details, please contact us.
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Specifications
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Standard
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Custom
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|---|---|---|
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Layer Count
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1 - 4 Layers
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6 - 64 Layers
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Turn Time
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24 hrs
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5 - 7 Weeks, over 7 days for special PCB design
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Quantity Req.
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5 - 10000+
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5- 10000+
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Materials
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FR-4
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FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp/Copper base material
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Plate Finish
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Lead-Free HAL*
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Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver OSP/Leaded & Lead-Free HAL
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Cert. / Qualifications
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IPC Class 2 - A600
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IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO 9001:2008
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Board Thickness
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0.4mm / 0.6mm / .8mm / 1mm/1.2mm/1.6mm/2.0mm/2.5mm/3.2mm
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Full Range Available
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Copper Weight
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1 oz. Inner / Up to 2 oz. Outer
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0.5 - 4 oz. Inner / 1 - 20 oz. Outer
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Trace/Space
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5 / 5 Mils
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Down to 2.75 / 3 Mils
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Solder Mask (LPI)
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Green
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Various Color Options
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Legend
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White
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Various Color Options
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Min. Hole Size
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0.010"
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0.004"
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Hole Tolerance
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+/- 0.005"
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+/- 0.003" (Upon Request)
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Rout Tolerance
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+/- 0.010"
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+/- 0.005" (Upon Request)
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Slots/Cutouts/Edges
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Non-Plated Only
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Plated / Non-Plated
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Plated Holes
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Plated / Non-Plated
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Plated / Non-Plated
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UL Markings/Dates
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Yes**
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Yes**
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Lead-Free Markings
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Yes
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Yes
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Gold Fingers
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Yes
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Yes
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Fiducials
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Yes
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Yes
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Scoring
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Yes
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Yes
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|
ITAR
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Yes
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Yes
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Castellated Holes
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X
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Yes
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Controlled Dielectric
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X
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Yes
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Controlled Impedance
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X
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Yes
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Counter Sinks
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X
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Yes
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Counter Bores
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X
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Yes
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Blind/Buried Vias
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X
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Yes
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Microvias
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X
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Yes
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Mask Plugged Vias
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X
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Yes
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Via-in-Pad
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X
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Yes
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Etch Back
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X
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Yes
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Tetra Etch
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X
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Yes
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Cover Coat
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X
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Yes
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Cavity Process
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X
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Yes
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Laser Rout
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X
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Yes
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LPI Legend
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X
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Yes
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Edge Mill
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X
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Yes
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Unique Serialization
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X
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Yes
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Back Drilling
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X
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Yes
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Controlled Depth Drill
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X
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Yes
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