| Requirement (Baisc PCB) | Quick Turn Availability (QTA) Lead Time ( hrs）* 24Hrs & 48Hrs | |||||||
| Board Thicknes (mm) | 0.2 | 0.4 | 0.6 | 0.8 | 1 | 1.2 | 1.6 | 2 |
| Layer 1 | × | × | √ | √ | √ | √ | √ | √ |
| Layer 2 | √ | √ | √ | √ | √ | √ | √ | √ |
| Layer 4 | × | √ | √ | √ | √ | √ | √ | √ |
| For board thickness ≥ 1.0mm, the thickness tolerance is +/-10%. For board thickness < 1.0mm, the thickness tolerance is +/-0.1mm. |
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| Surface Finish | HASL (Lead) | HASL (Lead Free) | EING (Golden Finger chamfering) | |||||
| Layer 1 | × | √ | √ | Yes | ||||
| Layer 2 | √ | √ | √ | Yes | ||||
| Layer 4 | × | √ | √ | Yes | ||||
| Depanelization method | Single Pieces | Panel set | ||||||
| Layer 1 | √ | √ | ||||||
| Layer 2 | √ | √ | ||||||
| Layer 4 | √ | √ | ||||||
| The following board materials are all general-purpose; you can choose any one based on your needs,with no layer count restrictions | ||||||||
| Base Material | PN | Glass Transition Temperature (TG) | Fire Resistant | |||||
| KB | KB6146 | TG135 | 94V_0 | |||||
| KB | KB-6165F | TG155 | 94V_0 | |||||
| Taiwan Nanya | NP-140F | TG140 | 94V_0 | |||||
| Taiwan Nanya | NP-140F | TG155 | 94V_0 | |||||
| Shengyi | S1141 | TG140 | 94V_0 | |||||
| Shengyi | S1000H | TG155 | 94V_0 | |||||
| *Solder Mask Color | Green | Red | Yellow | Blue | White | purple | matte Black | |
| *Silkscreen Color | White | White | White | White | matte black | White | White | |
| *For impedance and stack-up calculations, Designers can refer to mention a specific tool,Altium Designer、Cadence Allegro e.g., the Altium impedance calculator or Saturn PCB Toolkit], and provide us with the calculated stack-up scheme and impedance parameters. We will then verify and fine-tune them based on our production process and material library, finally providing a manufacturable stack-up report. | ||||||||
| Solder Mask Opening: Solder mask opening is designed and manufactured 1:1 with all board pads. (For re-orders, the original production data will be used.) The single-sided clearance of the opening from the pad will be ≥ 0mm. (Customers' original data can be designed with a clearance ≥ 0.02mm per side, and our engineering team will make the necessary adjustments.) The clearance from the pad edge to the line edge must be ≥ 0.09mm |
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| Via Plugging with Solder Mask for Opaque Effect (See Detailed Instructions): Only vias that have solder mask on pads on both sides can be filled with ink. On double-sided boards, if a via has a single-sided pad opening and its diameter is < 0.4mm, only partial plugging is possible (and may be translucent). If a via is partially on an open pad, it will be partially plugged (and may be translucent). This is determined based on the specific design file. All vias designated for solder mask plugging must have a diameter between 0.15mm and 0.5mm. |
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| Vias plugged with resin with electroplated capping Vias plugged with copper paste with electroplated capping ① Treatment for planarization with resin/copper paste plugged vias and electroplated capping. (For high thermal conductivity requirements, select copper paste for plugging) ② For multilayer boards with 6 or more layers, vias default to resin plugged with electroplated capping. ③ All vias to be plugged with resin/copper paste must have a diameter between 0.15mm and 0.55mm |
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| Solder mask thickness ≧10um, Minimal Solder Mask Bridge Design Data Finished Copper Thickness: 1oz Pad Spacing ≥ 0.10mm: (Suitable for Green, Red, Yellow, Blue, and Purple inks) Pad Spacing ≥ 0.13mm: (Suitable for Black and White inks) Finished Copper Thickness (2oz): Pad Spacing ≥ 0.20mm (suitable for all ink colors) |
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| *Touting Edge ① Routing edge wiring and pads must be at a distance of ≥ 0.2mm from the board edge. ② Wiring and pads must be at a distance of ≥ 0.2mm from the routing groove. ③ Routing edge profile tolerance: ±0.2mm (Standard routing), ±0.1mm (High-precision routing). ④ For high-precision routed boards, the minimum single piece dimension must be ≥ 50mm x 50mm. (High-precision routing requires three fiducial holes in different locations, with a diameter of ≥ 1.5mm). ⑤ The minimum routing groove width for aluminum-based/copper-based boards is 1.6mm. |
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| * V-ScoringTraces and pads must be at a distance of ≥ 0.4mm from the V-cut line. V-cut profile tolerance: ±0.4mm (for board thickness ≥ 0.6mm). Default panelization uses a 0mm gap. (For panels that only require V-scoring on two sides, the other two sides can use a 1.6mm or 2mm panelization gap to allow for routing). Minimum V-cut panel size: 70mm. Maximum V-cut panel size: 475mm. The minimum spacing between adjacent V-cut lines is 3mm (with a limit of 2mm). |
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| *Tab routing with breaking holes ① For non-perforated (non-stamp-hole) routing, traces and pads must be at a distance of ≥ 0.2mm from the board edge. ② Routing tolerance for non-perforated edges: ±0.2mm (Standard routing), ±0.1mm (High-precision routing). ③ The default panelization gap is 1.6mm or 2mm. ④ The stamp-hole locations will have a toothed edge after depaneling. ⑤ The minimum process edge width is 3mm. |
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