• Prototype PCB Assembly Capabilities
  • Prototype PCB Assembly Capabilities

Prototype PCB Assembly Capabilities

  Core Assembly Capabilities
  • Solder Paste Application (SMT): For surface mount components, the fundamental capability is the precise application of solder paste to the designated pads on the PCB using a metal stencil. This ensures the correct amount of solder is applied exactly where needed.
  • Component Placement: Components must be accurately placed onto the board.
    • Surface Mount Technology (SMT): Uses automated pick-and-place machines to mount tiny components directly onto the solder paste with high precision.
    • Through-Hole Technology (THT): Involves inserting component leads into pre-drilled holes, which can be done manually or with automated insertion equipment for high volume.
  • Soldering: This process creates a permanent electrical and mechanical connection.
    • Reflow Soldering (SMT): The board is passed through a reflow oven with a controlled temperature profile, which melts the solder paste and then cools it to form solid joints.
    • Wave Soldering (THT): The bottom of the board is passed over a "wave" of molten solder, which solders all component leads simultaneously on the underside of the board.
  • Prototype PCB Assembly Capabilities

Description

PRINTED CIRCUIT BOARD ASSEMBLY*SMD/DIP

           *Prototype assembly and Small batch supported

View Details for Printed circuit board requirement.
PCB Assembly File 

PCB files (Gerber files/other PCB files, etc.,) 
Centroid( Pick&place PNP file,or XY Data or files in other formarts)

Bill of material(BOM),including the details,such as designators.
Parts description,manufacturer,and part number,quantity,package,etc.
Any PCBA assembly data or documents/image/3D pictures.
Drawing are more favorable for assembly,test procedures,any mechanical restriction such as height requirements.
Board Pattern

Rectangular,circular and any polygon,special outline.

For special outline,we do suggest make panel PCB before assembly.
Rohs or non Rohs
Lead and Lead-Free ( Rohs complaint) 
Stencils
In consider of solder reliability,we use laser cut stainless steel stencils for fine pitch and BGA,For PCBA order,SMD-stencil

if free of charge.
Consigned/Kitted
part number,quantity,description,package size.
Turn-key service
One-stop PCB Assembly service to save time and cost for clients.
BGA
BGA with X-ray and rework capability
Soldering Type
Surface mount(SMT),Thru-Hole(THT) and hybrid of both,single or double-sided placement,manual  soldering and MNT machine.
MOQ
5 sets PCBA
Package size
0201,0402,0603,0805,1206

Board Dimension
Min board size:50mm*100mm ( Boards smaller than this size need to be panelized)
                                                    Max Board size:250mm*500mm
Quanlity Assurance

Wave soldering,Function testing,In-line AOI inspection,X-ray Inspection,Quanlity Gurantee is the basis of clients
trust.
Board type
Rigid and Flexible PCB are available for assembly
Rework and Repair

Taking account into the cost saving, rework and repair are supported, refund is also supported.
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